DeepMaterial Chip Underfill Adhesive series are one component, heat curable materials. The materials have been optimized for capillary underfill and reworkability. These epoxy based materials can be dispensed on the edges of the BGA, CSP or Flip Chip devices. This material will subsequently flow to fill the space beneath these components.
flipchipepoxy
flipchipepoxy
https://www.startus.cc/company/flipchipepoxy
7th Floor, Building C, Comlong Science & Technology Park, Guanlan High-tech Park
Long- hua District
Shenzhen Guangdong Sheng 518000
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7th Floor, Building C, Comlong Science & Technology Park, Guanlan High-tech Park
Long- hua District
Shenzhen Guangdong Sheng 518000Latest startups
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